Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Prezzi da
90,69

In evidenza

CONFRONTA TUTTI I WEBSHOP (2)

Descrizione

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Description Descrizione
Product Specifications Specifiche del prodotto
Risultati correlati Risultati correlati
Next
Previous

Confronta i webshop (2)

Ordina per:

90,69 €

90,69 €

Descrizione (0)

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Specifiche del prodotto

Marchio Independently Published
EAN
  • 9798189958878

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,56 €
Confronta 2 negozi 2 negozi

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

183,03 €
Confronta 2 negozi 2 negozi

Springer-Verlag GmbH

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

112,54 €
Confronta 2 negozi 2 negozi

Independently Published

Semiconductor Engineering Handbook: Devices, Fabrication, EUV Lithography, Advanced Packaging, Chiplets, and AI...

57,41 €
Confronta 2 negozi 2 negozi
Scelta in evidenza
90,69 €
Vai allo shop