HANDBUCH FÜR FORTSCHRITTLICHES HALBLEITER-PACKAGING: Chiplets, heterogene Integration und 2,5D-/3D-Aufbautechnik für Design, Fertigung, Zuverlässigkeit Test

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HANDBUCH FÜR FORTSCHRITTLICHES HALBLEITER-PACKAGING: Chiplets, heterogene Integration und 2,5D-/3D-Aufbautechnik für Design, Fertigung, Zuverlässigkeit Test

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HANDBUCH FÜR FORTSCHRITTLICHES HALBLEITER-PACKAGING: Chiplets, heterogene Integration und 2,5D-/3D-Aufbautechnik für Design, Fertigung, Zuverlässigkeit Test

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Marchio Independently Published
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  • 9798164879273

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

90,69 €
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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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