3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

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3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

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3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

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Marchio Independently Published
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  • 9798172479724

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