Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

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Descrizione (1)

Pagine: 550, Copertina flessibile, Independently published

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  • 9798190431759

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

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