Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Prezzi da
67,57

In evidenza

CONFRONTA TUTTI I WEBSHOP (2)

Descrizione

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Description Descrizione
Product Specifications Specifiche del prodotto
Risultati correlati Risultati correlati
Next
Previous

Confronta i webshop (2)

Ordina per:

67,57 €

67,57 €

Descrizione (0)

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Specifiche del prodotto

Marchio Independently Published
EAN
  • 9798190431759

Springer-Verlag GmbH

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

112,54 €
Confronta 2 negozi 2 negozi

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,56 €
Confronta 2 negozi 2 negozi

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

90,69 €
Confronta 2 negozi 2 negozi

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

117,89 €
Confronta 2 negozi 2 negozi
Scelta in evidenza
67,57 €
Vai allo shop